Bonding Semiconductor Laser Chips : Substrate Material Figure of Merit and Die Attach Layer Influence | Zendy

Anne-Claire Pliska | Zendy; Julien Mottin | Zendy; N. Matuschek | Zendy; C. Bosshard | Zendy

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Bonding Semiconductor Laser Chips : Substrate Material Figure of Merit and Die Attach Layer Influence

Author(s) -

Anne-Claire Pliska,

Julien Mottin,

N. Matuschek,

C. Bosshard

Publication year - 2005

Publication title -

hal (le centre pour la communication scientifique directe)

Language(s) - English

Resource type - Conference proceedings

Subject(s) - materials science , substrate (aquarium) , optoelectronics , die (integrated circuit) , thermal expansion , layer (electronics) , gallium arsenide , thermal conductivity , laser , soldering , semiconductor , reliability (semiconductor) , chip , semiconductor device , semiconductor laser theory , integrated circuit packaging , figure of merit , electronic engineering , composite material , nanotechnology , integrated circuit , electrical engineering , optics , engineering , oceanography , physics , geology , power (physics) , quantum mechanics

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