Open AccessBonding Semiconductor Laser Chips : Substrate Material Figure of Merit and Die Attach Layer Influence
Author(s) -
Anne-Claire Pliska,
Julien Mottin,
N. Matuschek,
Christian Bosshard
Publication year - 2005
Publication title -
hal (le centre pour la communication scientifique directe)
Language(s) - English
Resource type - Conference proceedings
Subject(s) - materials science , substrate (aquarium) , optoelectronics , die (integrated circuit) , thermal expansion , layer (electronics) , gallium arsenide , thermal conductivity , laser , soldering , semiconductor , reliability (semiconductor) , chip , semiconductor device , semiconductor laser theory , integrated circuit packaging , figure of merit , electronic engineering , composite material , nanotechnology , integrated circuit , electrical engineering , optics , engineering , oceanography , physics , geology , power (physics) , quantum mechanics