Open AccessFailure mechanisms and reliability of the Al-chip-metallization during power cycling
Author(s) -
Camille Durand,
Daniel Coutellier,
Hakim Naceur,
M. Klingler
Publication year - 2015
Publication title -
hal (le centre pour la communication scientifique directe)
Language(s) - English
Resource type - Conference proceedings
Subject(s) - power cycling , reliability (semiconductor) , reliability engineering , cycling , electromigration , temperature cycling , materials science , chip , power (physics) , electrical engineering , engineering , composite material , physics , archaeology , quantum mechanics , thermal , meteorology , history
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