Numerical modelling of compression moulding with SMC for the improvement of mechanical properties
Author(s) -
Min Soo Kim,
Woo Suck,
Alain Vautrin,
W.I. Lee
Publication year - 2007
Publication title -
hal (le centre pour la communication scientifique directe)
Language(s) - English
Resource type - Conference proceedings
Subject(s) - compression molding , finite element method , molding (decorative) , compression (physics) , process (computing) , materials science , composite number , sheet moulding compound , computer science , mechanical engineering , engineering drawing , structural engineering , composite material , engineering , mold , operating system
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