Open AccessDie Attach of Power Devices Using Silver Sintering - Bonding Process Optimization and Characterization
Author(s) -
Cyril Buttay,
Amandine Masson,
Jianfeng Li,
C. Mark Johnson,
Mihai Lazar,
Christophe Raynaud,
Hervé Morel
Publication year - 2011
Publication title -
hal (le centre pour la communication scientifique directe)
Language(s) - English
Resource type - Conference proceedings
Subject(s) - characterization (materials science) , sintering , materials science , die (integrated circuit) , process (computing) , process optimization , process engineering , computer science , composite material , nanotechnology , engineering , chemical engineering , operating system
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