Analyse multi-échelles des déformations/contraintes sur des assemblages électroniques complexes : application à la technologie flip-chip | Zendy

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Analyse multi-échelles des déformations/contraintes sur des assemblages électroniques complexes : application à la technologie flip-chip

Author(s) -

Anne laure Lebaudy,

Raphaël Pesci

Publication year - 2017

Publication title -

hal (le centre pour la communication scientifique directe)

Language(s) - French

Resource type - Conference proceedings

Subject(s) - flip chip , chip , computer science , geology , materials science , telecommunications , nanotechnology , adhesive , layer (electronics)

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