Open AccessEffect of Electrodeposition Parameters on Morphology of Copper Thin Films
Author(s) -
Jaishree Mathur
Publication year - 2013
Publication title -
iosr journal of engineering
Language(s) - English
Resource type - Journals
eISSN - 2278-8719
pISSN - 2250-3021
DOI - 10.9790/3021-03835561
Subject(s) - morphology (biology) , copper , materials science , computer science , chemical engineering , metallurgy , zoology , biology , engineering
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