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Comparative Study of Four-Point Measurements of Copper Thin Films Resistivity in Aligned and Square Configuration at Low Frequencies
Author(s) -
Désiré Allassem,
B. Mahamout Mahamat,
Adoum Kriga,
M.H. Bechir,
Yaya Dagal Dari,
Mahamat Ahmat Taha,
Yacoub Nassian Nimir,
J. P. Chatelon,
Jean-Jacques Rousseau
Publication year - 2022
Publication title -
journal of engineering research and reports
Language(s) - English
Resource type - Journals
ISSN - 2582-2926
DOI - 10.9734/jerr/2022/v23i11754
Subject(s) - van der pauw method , electrical resistivity and conductivity , materials science , thin film , copper , square (algebra) , sputter deposition , sputtering , electrical engineering , metallurgy , nanotechnology , hall effect , mathematics , geometry , engineering

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