Open AccessMachine Capability Enhancement to Address Lacking Epoxy Coverage during Die Attach Process of QFN Packages
Author(s) -
Jerome J. Dinglasan
Publication year - 2022
Publication title -
journal of engineering research and reports
Language(s) - English
Resource type - Journals
ISSN - 2582-2926
DOI - 10.9734/jerr/2022/v22i1017569
Subject(s) - quad flat no leads package , epoxy , manufacturing engineering , die (integrated circuit) , computer science , production line , automation , product (mathematics) , engineering , mechanical engineering , materials science , composite material , mathematics , adhesive , geometry , layer (electronics)