Open AccessResolution of Low IMC on Multi-Stacked Dice Device with Different Bond Pads
Author(s) -
F. Folio,
Roy B. Guingab,
Frederick Ray I. Gomez,
Jonathan C. Pulido
Publication year - 2021
Publication title -
journal of engineering research and reports
Language(s) - English
Resource type - Journals
ISSN - 2582-2926
DOI - 10.9734/jerr/2021/v20i917370
Subject(s) - design for manufacturability , dice , miniaturization , die (integrated circuit) , reliability (semiconductor) , product (mathematics) , intermetallic , substrate (aquarium) , wire bonding , computer science , integrated circuit , electrical engineering , engineering drawing , engineering , electronic engineering , mechanical engineering , materials science , power (physics) , physics , mathematics , oceanography , geometry , alloy , quantum mechanics , geology , chip , composite material
The continuing advances of die technology of integrated circuits (IC) miniaturization bringing more complexity in the product. At unusual conditions one may encounter new challenges intrinsic to the structure of the package. The study aims to qualify a product such as multi-stacked dice configurations with baseline reference using same die technology. The only difference is the substrate layout in which defined for the electrical purpose. The challenge is to understand and resolve low intermetallic coverage (IMC) on each die which may lead to manufacturability and reliability problems over time.