Open AccessWire Shorting Defect Mitigation on Substrate LGA Device Through Wirebond Capillary Adjustment
Author(s) -
Jonathan C. Pulido,
Frederick Ray I. Gomez,
Raymond Albert Narvadez
Publication year - 2021
Publication title -
journal of engineering research and reports
Language(s) - English
Resource type - Journals
ISSN - 2582-2926
DOI - 10.9734/jerr/2021/v20i917367
Subject(s) - wire bonding , capillary action , materials science , process (computing) , electronic packaging , integrated circuit packaging , die (integrated circuit) , mechanical engineering , computer science , engineering , electrical engineering , optoelectronics , integrated circuit , composite material , nanotechnology , chip , operating system
Semiconductor packaging technologies are getting more challenging with regards to assembly manufacturing due to several factors such as complex package layout, process and machine capability, and materials compatibility. This paper discusses the wirebonding process difficulty and the solution to mitigate the wire-to-wire shorting defect on a substrate land grid array (LGA) device that causes low yield on engineering trials. Using a high-speed camera equipment, the actual process was monitored. It was then noticed that the cause of wire-to-wire shorting issue was a capillary hitting on previous wire. Ultimately, with the new capillary design and process optimization, wire-to-wire shorting defect was successfully mitigated.