Open AccessEpoxy Fillet Height Study of Tapeless QFN Leadframe Package on Different Diebonders
Author(s) -
Edwin M. Graycochea,
Rennier S. Rodriguez,
Frederick Ray I. Gomez
Publication year - 2021
Publication title -
journal of engineering research and reports
Language(s) - English
Resource type - Journals
ISSN - 2582-2926
DOI - 10.9734/jerr/2021/v20i817353
Subject(s) - quad flat no leads package , fillet (mechanics) , engineering drawing , computer science , mechanical engineering , materials science , engineering , composite material , adhesive , layer (electronics)
The paper focused on the evaluation of quad-flat no-leads (QFN) device in tapeless leadframe technology on different diebonder platforms to achieve an acceptable fillet height performance. The study was narrowed down into two main machines with the objective of attaining a fillet height of less than 75 % for small die. Eventually, the fillet height requirement was achieved by both diebonder platforms, hence, these machines could be used for future works on devices with similar requirement.