Open AccessElimination of Intermetallic Coverage Over-etching on Aluminum Pad
Author(s) -
Jonalyn Jaylo-Sia,
Jonathan C. Pulido,
Frederick Ray I. Gomez
Publication year - 2021
Publication title -
journal of engineering research and reports
Language(s) - English
Resource type - Journals
ISSN - 2582-2926
DOI - 10.9734/jerr/2021/v20i717351
Subject(s) - intermetallic , materials science , polishing , aluminium , reliability (semiconductor) , ball (mathematics) , metallurgy , reliability engineering , engineering , thermodynamics , physics , mathematical analysis , power (physics) , mathematics , alloy
Intermetallic coverage (IMC) is one of the critical wirebond output responses that is usually checked to ensure the ball to pad integrity. The success of wirebonding relies on the formation of an interfacial intermetallic growth of ball bond to ensure it can withstand reliability stresses. The challenging approach in IMC analysis detect as over-etching around IMC area that leads to inaccurate IMC data collection. To address the over-etching, we generate a new method which is backside polishing that results to a reliable IMC data collection and help reduced the cycle time of IMC data gathering.