Open AccessImproving the Solder Joint Reliability Prediction Accuracy for Quad Flat No Lead Packages
Author(s) -
Jefferson Talledo
Publication year - 2021
Publication title -
journal of engineering research and reports
Language(s) - English
Resource type - Journals
ISSN - 2582-2926
DOI - 10.9734/jerr/2021/v20i717344
Subject(s) - soldering , reliability (semiconductor) , joint (building) , quad flat no leads package , finite element method , creep , strain energy density function , structural engineering , computer science , mechanical engineering , materials science , engineering , power (physics) , metallurgy , physics , adhesive , layer (electronics) , quantum mechanics , composite material
This paper discusses the modeling approach used in improving the solder joint reliability prediction for Quad Flat No Lead (QFN) packages. A new power equation fatigue prediction model was developed based on the accumulated creep strain energy density from FEA (finite element analysis) simulation and the corresponding actual experimental result in terms of solder characteristic life of different QFN packages. The new curve fitted fatigue life correlation equation was then used in the solder joint reliability modeling together with the use of a hyperbolic sine constitutive model for lead-free solder. The model prediction using the new curve fitted equation was compared with the result from using the equation previously published. Based on the results, the new curve-fitted life prediction equation was able to improve the accuracy of solder life prediction. This study shows that solder joint reliability prediction could be improved by developing a prediction model based on actual data and consistent FEA modeling considerations in terms of methodology, material model and properties.