Open AccessA Robust Approach of Maintaining Epoxy Position on Die Attach Process of Tapeless QFN Packages
Author(s) -
Jerome J. Dinglasan,
Leandro D. Saria,
Frederick Ray I. Gomez
Publication year - 2021
Publication title -
journal of engineering research and reports
Language(s) - English
Resource type - Journals
ISSN - 2582-2926
DOI - 10.9734/jerr/2021/v20i617333
Subject(s) - epoxy , quad flat no leads package , die (integrated circuit) , position (finance) , robustness (evolution) , computer science , process (computing) , manufacturing engineering , engineering , engineering drawing , mechanical engineering , materials science , composite material , layer (electronics) , operating system , business , biochemistry , chemistry , adhesive , finance , gene
Epoxy quality contributes a great role in defining quality products of quad flat no lead multi row packages. In dealing with certain problems related to epoxy position shift caused by unoptimized design, innovation on the dispenser module is considered and focused at. This paper discusses the phenomenal issue of epoxy position shifting in die attach process and the solutions applied. The current design of dispenser module in die attach machine demonstrates flaws that need to be improved through design optimization. Innovative approach was applied, removing variables on the design that caused rejections during die attachment due to the shifted epoxy position. The improved design was able to address the issue as projected on the study, and helps not only the epoxy position performance, but also the set-up time of epoxy during syringe replacement. This design can be adapted by other manufacturing for process improvement and robustness.