Open AccessImprovement on QFN Leadframe Design of Extended Leads to Support the Mitigation of Mold Flash Occurrence
Author(s) -
Alyssa Grace S. Gablan,
Frederick Ray I. Gomez,
Anthony Moreno
Publication year - 2021
Publication title -
journal of engineering research and reports
Language(s) - English
Resource type - Journals
ISSN - 2582-2926
DOI - 10.9734/jerr/2021/v20i517309
Subject(s) - quad flat no leads package , wire bonding , offset (computer science) , mold , lead frame , robustness (evolution) , flash (photography) , reliability engineering , computer science , mechanical engineering , engineering , materials science , chip , adhesive , electrical engineering , layer (electronics) , nanotechnology , composite material , semiconductor device , art , visual arts , programming language , biochemistry , chemistry , gene
Parameter optimization is not only the key to find the most favorable and best solution as variable chances of failure modes may happen at extreme case conditions at unexpected period. Packaging design robustness is much resilient to establish a satisfactorily good quality product and sustain a long-term goal of a remarkable process capability. This paper presents leadframe design solution of quad-flat no leads (QFN) to address mold flash defect caused by leadframe bouncing during wirebonding. An inverted pyramid configuration was conceptualized to provide better stability than the standard configuration during wirebonding process and other concerned assembly processes due to the shift of the center of gravity moving closer to the full metal part.