Open AccessDie Attach Curing Program Automation of N2 Parameter for Process Robustness
Author(s) -
Jerome J. Dinglasan,
Rogel Dela Rosa,
Frederick Ray I. Gomez
Publication year - 2021
Publication title -
journal of engineering research and reports
Language(s) - English
Resource type - Journals
ISSN - 2582-2926
DOI - 10.9734/jerr/2021/v20i417304
Subject(s) - automation , curing (chemistry) , semiconductor device fabrication , manufacturing engineering , computer science , process engineering , reliability engineering , engineering , materials science , mechanical engineering , electrical engineering , composite material , wafer
In the world of semiconductor industry, automation plays a big role on every manufacturing plants to improve efficiency, prevent product yield losses, and making sure that top quality products will be delivered on end user. On die attach curing process of manufacturing semiconductor integrated circuits (IC) devices, certain problems occur like wrong Nitrogen (N2) parameter setting on the oven curing machine, with human intervention during setup, causing leadframe oxidation related defects. The paper discussed the importance of automation system on processing semiconductor IC products on die attach curing process, eliminating mostly human intervention on setting up machine parameters, storing and managing programs, restrict unauthorize users from accessing, provide friendly user procedures to prevent human errors and prevent oxidation related defects.