Open AccessEstablishing Robust Control for Epoxy Open Time
Author(s) -
Michael D. Capili
Publication year - 2021
Publication title -
journal of engineering research and reports
Language(s) - English
Resource type - Journals
ISSN - 2582-2926
DOI - 10.9734/jerr/2021/v20i317280
Subject(s) - epoxy , reliability (semiconductor) , materials science , composite material , reliability engineering , computer science , engineering , physics , power (physics) , quantum mechanics
The Open time is called the time it takes for this chemical transition from liquid to solid. The epoxy moves into a gel state from the liquid state as it recovers, until it enters a solid-state. This article will address the development of a new, regulatory-compliant in die attach epoxy that establishes robust Epoxy Open Time control to improve the performance of product reliability with the following quality output response characteristic in Die Attach was consider; Epoxy Coverage, epoxy voids, Bond Line Thickness (BLT), and Die Shear Test (DST) strength response.