Modeling Study on the Solder Joint Reliability of a Leadframe Package under Powered Thermal Cycling | Zendy

Jefferson Talledo | Zendy

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Modeling Study on the Solder Joint Reliability of a Leadframe Package under Powered Thermal Cycling

Author(s) -

Jefferson Talledo

Publication year - 2021

Publication title -

journal of engineering research and reports

Language(s) - English

Resource type - Journals

ISSN - 2582-2926

DOI - 10.9734/jerr/2021/v20i317279

Subject(s) - temperature cycling , soldering , reliability (semiconductor) , joint (building) , finite element method , dwell time , power cycling , materials science , die (integrated circuit) , thermal , electronic packaging , mechanical engineering , structural engineering , thermal analysis , power (physics) , engineering , composite material , medicine , clinical psychology , physics , quantum mechanics , meteorology

This paper aims to present a thermo-mechanical modeling approach to predict the solder joint reliability of a leadframe-based package under powered thermal cycling (PTC) test from -40oC to 105oC. The study involves modeling the PTC condition as a standard thermal cycling with a modified temperature boundary to account for the temperature increase due to the applied power to the device package mounted on board. The temperature ramp and dwell times were maintained. Based on the finite element analysis (FEA) results and comparison with actual data, modeling a PTC as a modified thermal cycling process provides a good prediction of the solder joint life. The analysis is simpler and would be beneficial for getting quick assessments of new leadframe package designs.

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