Open AccessGlue Voids Reduction on QFN Device through Material and Process Improvement
Author(s) -
Edwin M. Graycochea,
Endalicio D. Manalo,
Rennier S. Rodriguez,
Frederick Ray I. Gomez
Publication year - 2021
Publication title -
journal of engineering research and reports
Language(s) - English
Resource type - Journals
ISSN - 2582-2926
DOI - 10.9734/jerr/2021/v20i317275
Subject(s) - glue , quad flat no leads package , stencil , materials science , die (integrated circuit) , reduction (mathematics) , composite material , engineering drawing , mechanical engineering , computer science , engineering , nanotechnology , adhesive , layer (electronics) , mathematics , computational science , geometry
The paper is focused on the glue voids reduction on critical semiconductor quad-flat no-leads (QFN) device processed on a stencil printing type of die attach machine. Process optimization through material preparation improvement was done to mitigate the silver lumps of the sintering glue which is a main contributor on the voids occurrence. Eventually, the glue voids were reduced to less than the allowed 5% limit. For future works, the learnings and configuration could be used on devices with similar requirement.