Open AccessUnderstanding Package Crack Signatures in a Leadframe Semiconductor Package
Author(s) -
Jefferson Talledo
Publication year - 2021
Publication title -
journal of engineering research and reports
Language(s) - English
Resource type - Journals
ISSN - 2582-2926
DOI - 10.9734/jerr/2021/v20i317274
Subject(s) - root cause , computer science , r package , semiconductor , package design , signature (topology) , integrated circuit packaging , fracture mechanics , software package , structural engineering , materials science , mechanical engineering , reliability engineering , engineering drawing , engineering , integrated circuit , computational science , software , mathematics , optoelectronics , programming language , geometry , operating system
This paper presents the simulation approach used to understand package crack signatures of a leadframe package under different mechanical loading scenarios. Package crack is one of the common problems with semiconductor packages. A better understanding of the different crack signatures would help identify the root cause quickly and be able to find the correct solution. In this study, a high precision materials testing system was used to apply mechanical loading to the package simulating different scenarios that could produce the crack. Based on the testing results, cracks have distinct signatures depending on how the force is applied. With the different signatures identified, this approach makes it easy to find the root cause of the crack in actual applications or assembly processes and resolve the problem faster.