Open AccessUnderstanding Package Delamination through Package Deformation Modeling at Different Thermal Conditions
Author(s) -
Jefferson Talledo
Publication year - 2021
Publication title -
journal of engineering research and reports
Language(s) - English
Resource type - Journals
ISSN - 2582-2926
DOI - 10.9734/jerr/2021/v20i217278
Subject(s) - delamination (geology) , deformation (meteorology) , package on package , materials science , quad flat no leads package , package design , composite material , mold , integrated circuit packaging , structural engineering , engineering drawing , adhesive , layer (electronics) , integrated circuit , engineering , geology , optoelectronics , paleontology , wafer dicing , subduction , tectonics
Package delamination is one of the problems in semiconductor packaging. Understanding the delamination mechanism in a specific situation is very important to identify the root cause and implement robust solution. In this study, package deformation modeling was done to analyze the deformation of the substrate or package at different thermal conditions. The modeling result was compared with the actual package deformation of the package with delamination problem. It was found out that the observed deformation through actual cross-section analysis matched with the modeling result at reflow temperature condition. Thus, it could be concluded that the delamination happens during package reflow and not after post mold cure or the preceding processes.