Open AccessMechanical Modeling Study on the Impact of Pick-and-Place Design on Die Attach Voids
Author(s) -
Jefferson Talledo
Publication year - 2021
Publication title -
journal of engineering research and reports
Language(s) - English
Resource type - Journals
ISSN - 2582-2926
DOI - 10.9734/jerr/2021/v20i217269
Subject(s) - die (integrated circuit) , natural rubber , adhesive , composite material , materials science , deformation (meteorology) , nanotechnology , layer (electronics)
Pick-and-place (PnP) rubber tip is used for the die attach process in semiconductor packaging. During the die attach process involving a very thin integrated circuit (IC) die, voids in the die attach film (DAF) adhesive were observed. This paper presents the modeling study conducted to understand the impact of PnP rubber tip design on the occurrence of DAF voids. Mechanical modeling was done to simulate the deformation of the very thin die when it is picked using the PnP rubber tip. Different PnP rubber tip designs were modeled. The results revealed that the die deforms during the die pick up process because of the vacuum force, and rubber tip design affects the amount of deformation. It was also found out that more DAF voids occur when the resulting die deformation is larger.