Open AccessBall Crack Mitigation through Wirebond Process Optimization
Author(s) -
Anthony Moreno,
Frederick Ray I. Gomez,
Rennier S. Rodriguez
Publication year - 2021
Publication title -
journal of engineering research and reports
Language(s) - English
Resource type - Journals
ISSN - 2582-2926
DOI - 10.9734/jerr/2021/v20i217259
Subject(s) - intermetallic , flatness (cosmology) , wire bonding , materials science , aluminium , metallurgy , reliability engineering , structural engineering , engineering , alloy , chip , physics , cosmology , quantum mechanics , electrical engineering
Intermetallic is a critical factor that is controlled and limit during manufacturing of integrated units. Through improving the ball flatness response of the semiconductor wire significantly impact the outcome for the intermetallic characteristic between metal such as Gold-Aluminum connection. The implementation of this study on the actual manufacturing control eliminates escapee of poor intermetallic that would impact the reliability and integrity of the package upon its application to the end product.