Using Element Birth and Death Technique in Modeling Cumulative Molded Substrate Expansion before Singulation

Semiconductor packages are commonly assembled and molded in array format on a substrate strip before they are singulated into individual units. However, cumulative substrate expansion causes problems such as machine vacuum error or misaligned cut during singulation if the substrate expansion is not factored in. This study uses element birth and death technique in modeling the overall expansion of the molded substrate strip so that the predicted expansion could be considered in the singulation tooling design offsets. The expansion of the substrate was modeled with the different package assembly processes and thermal conditions. Modeling results showed that there is a cumulative increase in the length of the substrate as it passes through the different processes. The results are in agreement with actual substrate expansion prior to package singulation. This would not be captured when simulation is done only for the molded substrate without considering the cumulative contribution of the preceding processes. With the element birth and death technique in process-based thermomechanical modeling, substrate expansion could already be forecasted, and package assembly problems avoided.