Open AccessProcess Optimization to Eliminate Automatic Alignment Failures on the Scalable Device
Author(s) -
Antonio R. Sumagpang,
Frederick Ray I. Gomez,
Rennier S. Rodriguez
Publication year - 2020
Publication title -
journal of engineering research and reports
Language(s) - English
Resource type - Journals
ISSN - 2582-2926
DOI - 10.9734/jerr/2020/v18i117197
Subject(s) - scalability , pareto chart , process (computing) , reliability engineering , engineering , reverse engineering , computer science , engineering drawing , manufacturing engineering , pareto principle , operations management , database , programming language , operating system
The paper focused in addressing the auto align defect at in-strip testing of a semiconductor scalable device in a leadframe technology. Pareto diagram and potential risk analysis were completed to identify the top reject contributors and eventually come-up with the robust solution. Reverse flow was employed to eliminate the alignment issues. The reverse flow, which is testing prior singulation process, eventually resolved the auto align and other singulation related defects as testing is done on a strip form. Ultimately, the error-proofing or Poka-Yoke approach by reverse flow lead to the elimination of auto align failures at final test. For future works, the parameters and learnings could be used on devices with similar assembly defect occurrence.