Open AccessElimination of Smashed Ball Defect through Process and Design Improvement
Author(s) -
Jonathan C. Pulido,
Rennier S. Rodriguez,
Frederick Ray I. Gomez
Publication year - 2020
Publication title -
journal of engineering research and reports
Language(s) - English
Resource type - Journals
ISSN - 2582-2926
DOI - 10.9734/jerr/2020/v17i417195
Subject(s) - wire bonding , ball (mathematics) , mechanical engineering , vibration , engineering , structural engineering , materials science , composite material , electrical engineering , physics , acoustics , chip , geometry , mathematics
This paper presents the modification and improvement done on the wire clamp and top plate (WCTP) design to eliminate the bouncing effect of the silicon die that leads to smashed ball reject during the formation of wire. The protrusion of the unit on the vacuum hole produced movement and slight vibration that affects the consistency of wirebonding. Through changing the standard vacuum hole to micro-holes provides underneath support to the unit and eliminates the overhanging or protrusion during the formation of wire. The implementation of the micro-hole design reduced the defect parts per million (dppm) occurrence to zero.