Open AccessIntegration of EMI Shielding Design for Substrate Package Isolation
Author(s) -
Frederick Ray I. Gomez,
Rennier S. Rodriguez
Publication year - 2020
Publication title -
journal of engineering research and reports
Language(s) - English
Resource type - Journals
ISSN - 2582-2926
DOI - 10.9734/jerr/2020/v17i217184
Subject(s) - electromagnetic shielding , emi , electromagnetic interference , substrate (aquarium) , layer (electronics) , materials science , printed circuit board , coating , interference (communication) , electrical engineering , electronic engineering , channel (broadcasting) , engineering , composite material , oceanography , geology
This paper presents a modified substrate design that would enable a bottom electromagnetic interference (EMI) shielding protection for EMI sensitive integrated unit (IC). The modified substrate design is applied and incorporated to the existing and known shielding technique to fully proof the structure to external interference through the application of EMI shielding layer on the substrate configuration. The EMI shielding layer will be connected to the surface coating (EMI shielding) and ground channel of the substrate and the external board.