Open AccessImplementing Single-Row Process Plate Design for Pre-Encapsulated Lead Frame
Author(s) -
Rennier S. Rodriguez,
Frederick Ray I. Gomez,
Jonathan C. Pulido
Publication year - 2020
Publication title -
journal of engineering research and reports
Language(s) - English
Resource type - Journals
ISSN - 2582-2926
DOI - 10.9734/jerr/2020/v16i217162
Subject(s) - lead frame , wire bonding , process (computing) , integrated circuit packaging , package design , electronic packaging , frame (networking) , materials science , engineering drawing , computer science , mechanical engineering , engineering , semiconductor device , electronic engineering , integrated circuit , optoelectronics , composite material , layer (electronics) , telecommunications , chip , operating system
This paper presents the application of an innovative design of wirebond process plate during wirebonding process of thin semiconductor carrier such as the pre-encapsulated leadframe. The implementation of the specialized process plate aims to improve the conventional method of wirebonding from panel type to single-row design to reduce the occurrence of warpage on thin leadframes. In this study, an 85% reduction for warpage level is achieved after the introduction of the new design of process plate. Future works could use the improved process plate design for devices of similar configuration.