Open AccessRubber-tip Design Improvement for Die Crack Elimination at Diebond Process
Author(s) -
Rennier S. Rodriguez,
Frederick Ray I. Gomez
Publication year - 2020
Publication title -
journal of engineering research and reports
Language(s) - English
Resource type - Journals
ISSN - 2582-2926
DOI - 10.9734/jerr/2020/v12i217074
Subject(s) - design for manufacturability , die (integrated circuit) , natural rubber , materials science , process (computing) , mechanical engineering , composite material , engineering , structural engineering , computer science , operating system
The paper focused on the elimination of die crack occurrence at the diebond process. Design of experiment (DOE) was done on the pick and place rubber-tip design and an improved design was finalized. The improved rubber-tip configuration with smaller vacuum design and full contact surface eventually resolved the die crack issues, improving the manufacturability of thin silicon die during diebond process. For future works, the configuration could be applied for packages with similar requirement.