Open AccessDetection of Organic Additives in Copper Plating Bath Using Voltammetric Methods That Involve a Screen-printed Nano-Au Electrode
Author(s) -
Yu–Ching Weng,
Joe ChunChia Huang,
Chih-Yao Wang,
Miao-Zhen Hong
Publication year - 2021
Publication title -
chemical science international journal
Language(s) - English
Resource type - Journals
ISSN - 2456-706X
DOI - 10.9734/csji/2021/v30i730241
Subject(s) - electrode , copper , electrochemistry , cyclic voltammetry , voltammetry , plating (geology) , differential pulse voltammetry , stripping (fiber) , materials science , anodic stripping voltammetry , linear sweep voltammetry , square wave , working electrode , chemistry , analytical chemistry (journal) , inorganic chemistry , chromatography , metallurgy , composite material , geophysics , geology , physics , voltage , quantum mechanics
Three electrochemical methods used to detect organic additives, A, B and C, in acidic plating baths. Cyclic voltammetric stripping (CVS) is used in industry to detect the concentration of organic additives indirectly by measuring the effect of commercial organic additives on the rate of copper deposition. This study directly determines the concentration of organic additives on a screen-printed nano-Au electrode at high potential using three different electrochemical methods: linear scanning voltammetry (LSV), differential pulse voltammetry (DPV) and square wave voltammetry (SWV). The results show that the response currents for the three electrochemical methods exhibit a linear relationship with the concentration of organic additives. The nano-Au electrode is the most sensitive device for the detection of organic additive B using LSV.