Open AccessA Study of Material Removal Characteristics by Friction Monitoring System of Sapphire Wafer in Single Side DMP
Author(s) -
Wonseok Jo,
Sangjik Lee,
Hyoungjae Kim,
Taekyung Lee,
Seongbeom Lee
Publication year - 2016
Publication title -
journal of the korean society of tribologists and lubrication engineers
Language(s) - English
Resource type - Journals
eISSN - 2287-4666
pISSN - 1229-4845
DOI - 10.9725/kstle.2016.32.2.56
Subject(s) - polishing , sapphire , materials science , wafer , chemical mechanical planarization , slurry , lapping , diamond , substrate (aquarium) , composite material , ingot , metallurgy , optoelectronics , optics , laser , physics , oceanography , alloy , geology
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