Open AccessTribology Characteristics in 200 μm of Hexagonal Array Dimple Pattern
Author(s) -
W. S. Choi,
S.H. Angga,
S. H. Kwon,
S. G. Kwon,
J. M. Park,
J. S. Kim,
S. W. Chung,
Y. H. Chae
Publication year - 2015
Publication title -
journal of the korean society of tribologists and lubrication engineers
Language(s) - English
Resource type - Journals
eISSN - 2287-4666
pISSN - 1229-4845
DOI - 10.9725/kstle.2015.31.2.50
Subject(s) - dimple , materials science , tribology , lubricant , lubrication , composite material , friction coefficient , abrasion (mechanical)
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