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Scheduling Methodology for MCP(Multi-chip Package) with Layer Sequence Constraint in Semiconductor Package
Author(s) -
Young-Hyun Jeong,
Kang-Hoon Cho,
You-In Choung,
Sang-Chul Park
Publication year - 2017
Publication title -
journal of the korea society for simulation
Language(s) - English
Resource type - Journals
ISSN - 1225-5904
DOI - 10.9709/jkss.2017.26.1.069
Subject(s) - chip , scheduling (production processes) , chip scale package , computer science , layer (electronics) , system on a chip , sequence (biology) , parallel computing , embedded system , engineering , materials science , nanotechnology , chemistry , telecommunications , operations management , biochemistry

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