Open AccessDesign and Implementation of Tangible Interface Using Smart Puck System
Author(s) -
Seon Hui Bak,
Jeong Bae Lee,
Jeong Ho Kim,
Heeman Lee
Publication year - 2015
Publication title -
journal of the korea society of computer and information
Language(s) - English
Resource type - Journals
eISSN - 2383-9945
pISSN - 1598-849X
DOI - 10.9708/jksci.2015.20.9.047
Subject(s) - interface (matter) , arduino , decodes , embedded system , computer science , capacitive sensing , computer hardware , operating system , decoding methods , telecommunications , bubble , maximum bubble pressure method
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