Open AccessThermal Pattern Comparison between 2D Multicore Processors and 3D Multicore Processors
Author(s) -
Hongjun Choi,
Jin-Woo Ahn,
Hyung-Beom Jang,
Jong-Myon Kim,
Cheol-Hong Kim
Publication year - 2011
Publication title -
journal of the korea society of computer and information
Language(s) - English
Resource type - Journals
eISSN - 2383-9945
pISSN - 1598-849X
DOI - 10.9708/jksci.2011.16.9.001
Subject(s) - multi core processor , computer science , workload , power consumption , reliability (semiconductor) , interconnection , thermal , partition (number theory) , parallel computing , power (physics) , embedded system , telecommunications , operating system , physics , mathematics , quantum mechanics , combinatorics , meteorology
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