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Manufacture of Dismantling Apparatus for Waste CPU Chip and Performance Evaluation
Author(s) -
A-Ram Joe,
Seungsoo Park,
Boram Kim,
Jaikoo Park
Publication year - 2016
Publication title -
journal of the korean institute of resources recycling
Language(s) - English
Resource type - Journals
eISSN - 2287-4380
pISSN - 1225-8326
DOI - 10.7844/kirr.2016.25.6.3
Subject(s) - ball grid array , chip , central processing unit , materials science , die (integrated circuit) , composite material , electrical engineering , computer hardware , engineering , computer science , nanotechnology , soldering

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