Open AccessManufacture of Dismantling Apparatus for Waste CPU Chip and Performance Evaluation
Author(s) -
Aram Joe,
Seungsoo Park,
Boram Kim,
Jaikoo Park
Publication year - 2016
Publication title -
jaweon recycling/jawon recycling
Language(s) - English
Resource type - Journals
eISSN - 2287-4380
pISSN - 1225-8326
DOI - 10.7844/kirr.2016.25.6.3
Subject(s) - ball grid array , chip , central processing unit , materials science , die (integrated circuit) , composite material , electrical engineering , computer hardware , engineering , computer science , nanotechnology , soldering