Open AccessDevelopment of Packaging Technology for CdTe Multi-Energy X-ray Image Sensor
Author(s) -
Youngman Kwon,
Youngjo Kim,
Cheolwoo Ryu,
Hyunhwa Son,
Byoungwook Kim,
Young-Ju Kim,
Byoung-Jung Choi,
YoungChoon Lee
Publication year - 2014
Publication title -
journal of the korean society of radiology
Language(s) - English
Resource type - Journals
eISSN - 2384-0633
pISSN - 1976-0620
DOI - 10.7742/jksr.2014.8.7.371
Subject(s) - cadmium telluride photovoltaics , flip chip , wire bonding , materials science , anodic bonding , optoelectronics , chip , nanotechnology , electrical engineering , wafer , layer (electronics) , adhesive , engineering
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