Open AccessDevelopment of Packaging Technology for CdTe Multi-Energy X-ray Image Sensor
Author(s) -
Youngman Kwon,
Young-Jo Kim,
Cheolwoo Ryu,
Hyunhwa Son,
Byoungwook Kim,
YoungJu Kim,
Byoung Han Choi,
YoungChoon Lee
Publication year - 2014
Publication title -
bangsaseon haghoe nonmunjib/journal of the korean society of radiology
Language(s) - English
Resource type - Journals
eISSN - 2384-0633
pISSN - 1976-0620
DOI - 10.7742/jksr.2014.8.7.371
Subject(s) - cadmium telluride photovoltaics , flip chip , wire bonding , materials science , anodic bonding , optoelectronics , chip , nanotechnology , electrical engineering , wafer , layer (electronics) , adhesive , engineering