Open AccessPrediction of the Impact Lifetime for Board-Leveled Flip Chips by Changing the Design Parameters of the Solder Balls
Author(s) -
Soo Jin Lee,
Seong Keol Kim
Publication year - 2015
Publication title -
han-guk saengsan jejo hakoeji/journal of the korean society of manufacturing technology engineers
Language(s) - English
Resource type - Journals
eISSN - 2508-5107
pISSN - 2508-5093
DOI - 10.7735/ksmte.2015.24.1.117
Subject(s) - flip chip , soldering , materials science , drop (telecommunication) , ball (mathematics) , drop impact , drop test , ball grid array , chip scale package , composite material , reflow soldering , mechanical engineering , optoelectronics , structural engineering , engineering , mathematical analysis , adhesive , mathematics , layer (electronics) , wafer , wetting