Open AccessImprovement of Filling Characteristics of Micro-Bumps in the Stencil Printing Process
Author(s) -
W.S. Seo,
ByungWook Min,
K. Park,
H.J. Lee,
J.B. Kim
Publication year - 2012
Publication title -
journal of the korean society of manufacturing technology engineers
Language(s) - English
Resource type - Journals
eISSN - 2383-4846
pISSN - 2233-6036
DOI - 10.7735/ksmte.2012.21.1.026
Subject(s) - stencil , process (computing) , solder paste , mechanical engineering , soldering , finite element method , materials science , engineering drawing , computer science , engineering , structural engineering , computational science , composite material , operating system
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