Topology Design Optimization and Experimental Validation of Heat Conduction Problems
Author(s) -
Song-Hyun Cha,
Hyun-Seok Kim,
Seonho Cho
Publication year - 2015
Publication title -
journal of the computational structural engineering institute of korea
Language(s) - English
Resource type - Journals
eISSN - 2287-2302
pISSN - 1229-3059
DOI - 10.7734/coseik.2015.28.1.9
Subject(s) - topology optimization , thermal conduction , topology (electrical circuits) , computer science , mathematical optimization , mathematics , engineering , physics , electrical engineering , thermodynamics , structural engineering , finite element method
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