Open AccessProgress in nanoscale dry processes for fabrication of high-aspect-ratio features: How can we control critical dimension uniformity at the bottom?
Author(s) -
Kenji Ishikawa,
Kazuhiro Karahashi,
Tatsuo Ishijima,
Sung-Il Cho,
Simon D. Elliott,
Dennis M. Hausmann,
D. Mocuta,
Aaron G. Wilson,
Keizo Kinoshita
Publication year - 2018
Publication title -
japanese journal of applied physics
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.487
H-Index - 129
eISSN - 1347-4065
pISSN - 0021-4922
DOI - 10.7567/jjap.57.06ja01
Subject(s) - fabrication , nanotechnology , design for manufacturability , nanoscopic scale , critical dimension , aspect ratio (aeronautics) , materials science , lithography , scale (ratio) , dry etching , etching (microfabrication) , plasma etching , engineering physics , computer science , engineering , optoelectronics , mechanical engineering , physics , medicine , alternative medicine , optics , pathology , quantum mechanics , layer (electronics)