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Progress in nanoscale dry processes for fabrication of high-aspect-ratio features: How can we control critical dimension uniformity at the bottom?
Author(s) -
Kenji Ishikawa,
Kazuhiro Karahashi,
Tatsuo Ishijima,
SungIl Cho,
Simon D. Elliott,
Dennis M. Hausmann,
D. Mocuta,
Aaron G. Wilson,
Keizo Kinoshita
Publication year - 2018
Publication title -
japanese journal of applied physics
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.487
H-Index - 129
eISSN - 1347-4065
pISSN - 0021-4922
DOI - 10.7567/jjap.57.06ja01
Subject(s) - fabrication , nanotechnology , nanoscopic scale , design for manufacturability , aspect ratio (aeronautics) , critical dimension , scale (ratio) , materials science , lithography , etching (microfabrication) , semiconductor device fabrication , computer science , engineering physics , engineering , mechanical engineering , optoelectronics , physics , wafer , alternative medicine , quantum mechanics , layer (electronics) , medicine , optics , pathology

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