Open AccessStudy on the thermal conductivity of diamond-like carbon functionally graded material on copper substrate
Author(s) -
Jing Wang,
Guichang Liu,
Hongling Li,
Hou Bao-Rong
Publication year - 2012
Publication title -
wuli xuebao
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.199
H-Index - 47
ISSN - 1000-3290
DOI - 10.7498/aps.61.058102
Subject(s) - copper , materials science , substrate (aquarium) , thermal conductivity , layer (electronics) , composite material , diamond , conductivity , electrical conductor , metallurgy , optoelectronics , oceanography , geology , chemistry
In recent years, with the rapid development of electronic technology and digital network information, copper has increasing applications in micro-electronics, micro-electro-mechanical systems and Hi-tech materials. However copper has its material limitations. In particular, it has relatively low hardness, high oxidation and wear rate, which have severely restricted its widespread applications. In this paper, aiming at difficulties of copper applications, Ti/TiC/DLC has been proposed as functionally graded material to deposit on the copper substrate with plasma depositing method, which intensifies the adhesion between DLC film and copper substrate and improves the properties of copper. The maximal value of thermal conductivity of DLC film with optimized parameter of graded intermediate layer is 3.63 Wm-1.K-1, which enhances the heat transfer effect of copper substrate.