Open AccessAn analytical thermal model for 3D integrated circuit considering through silicon via
Author(s) -
Zhangming Zhu,
Pengjian Zuo,
Yong Yang
Publication year - 2011
Publication title -
wuli xuebao
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.199
H-Index - 47
ISSN - 1000-3290
DOI - 10.7498/aps.60.118001
Subject(s) - through silicon via , thermal management of electronic devices and systems , three dimensional integrated circuit , thermal , matlab , integrated circuit , materials science , silicon , dissipation , software , electronic circuit , thermal analysis , equivalent circuit , computer science , electronic engineering , mechanical engineering , optoelectronics , electrical engineering , thermodynamics , physics , engineering , voltage , programming language , operating system
Based on the one-dimensional analytical thermal model for N strata stacked chips without through-silicon via (TSV), the equivalent thermal model for TSV is presented in this paper. And then, the corresponding analytical thermal model with considering TSV is deriveed. Finally, Matlab software is used to verify and analyze the influence of TSV on the thermal management of 3D IC intergration. The analysis results indicate that the TSV can effectively improve the heat dissipation of 3D IC circuits, and the increase of TSVss pitch can raise the temperature of the 3D IC circuit.