Open AccessAn optimization model of wire size for multi-objective constraint
Author(s) -
Zhangming Zhu,
Wan Da-Jing,
Yong Yang
Publication year - 2010
Publication title -
wuli xuebao
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.199
H-Index - 47
ISSN - 1000-3290
DOI - 10.7498/aps.59.4837
Subject(s) - computer science , cmos , bandwidth (computing) , constraint (computer aided design) , curve fitting , key (lock) , electronic engineering , telecommunications , mechanical engineering , machine learning , engineering , computer security
The optimization of wire size has become a key technology for improving the chip system performance. Based on the influence of the wire size of interconnects on the delay, power, area and bandwidth, we propose an idea of optimal wire size based on multi-objective optimization method and obtain a multi-objective constrained analytical model by curve-fitting approach. The Hspice verification shows that the analytical model presented in this paper has a high precision and the average error is less than 5%. The algorithm is simple and can effectively compensate for deficiencies in application of quality factor approach and it can be applied to computer-aided design of nano-scale complementary metal-oxide semiconductor (CMOS) system chips.