Open AccessMolecular dynamics study on the plastic behavior of monocrystalline copper under shock loading and unloading
Author(s) -
He An-Min,
Jian-Li Shao,
Qin Cheng-Sen,
Pei Wang
Publication year - 2009
Publication title -
wuli xuebao
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.199
H-Index - 47
ISSN - 1000-3290
DOI - 10.7498/aps.58.5667
Subject(s) - materials science , shock (circulatory) , copper , stacking , shock wave , dislocation , molecular dynamics , monocrystalline silicon , orientation (vector space) , stacking fault , composite material , mechanics , physics , metallurgy , nuclear magnetic resonance , medicine , quantum mechanics , silicon , geometry , mathematics
Molecular dynamics simulations were used to study the plastic behavior of copper monocrystal under shock loading and unloading. We obtained the Hugoniot relation for both 001 and 111 orientations and the melting pressure, which turns out to be in agreement with experiment. The results showed that higher initial temperature increases the possibility for the dislocation loop generate and expansion. The release behavior after the shock wave reaching the back of the sample was also analyzed. We found that the release behavior was quasi-elastic and most of the stacking-fault networks disappear behind the release wave along 001 orientation while few stacking faults disappear along 111 orientation.