Open AccessMicroscopic mechanism of void coalescence under shock loading
Author(s) -
Deng Xiaoliang,
Weiliang Zhu,
Zhenfei Song,
Hongliang He,
Fuqian Jing
Publication year - 2009
Publication title -
wuli xuebao
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.199
H-Index - 47
ISSN - 1000-3290
DOI - 10.7498/aps.58.4772
Subject(s) - coalescence (physics) , void (composites) , materials science , mechanics , shock wave , dislocation , shear (geology) , the void , molecular dynamics , composite material , physics , quantum mechanics , astrobiology
The influence of void configuration on void coalescence in single crystal copper under shock loading along 100 direction has been investigated with molecular dynamics MD simulation. The results reveal that the voids collapse and grow by means of emission of shear dislocation loops. In the tension stage, the voids first grow independently, then the plastic zone around the voids begin to interact and overlap, leading to the void coalescence. The pattern of void coalescence observed in our simulations coincides with the microscopic experimental results. We calculated for four different configurations, characterized by the angle θ formed by shock direction and the line connecting the two centers of voids, and found that among the four configurationsthe coalescence of the voids prefers to occur where θ is 60°. Based on the resolved shear stress model around the void, we can clearly explain the simulation results.