Open AccessThe surface energy and nano-adhesion behavior of some micro-component material in MEMS
Author(s) -
Wu Xue,
Guangming Xie,
Quan Wang,
Miao Zhang,
Zheng Bei-Rong
Publication year - 2009
Publication title -
wuli xuebao
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.199
H-Index - 47
ISSN - 1000-3290
DOI - 10.7498/aps.58.2518
Subject(s) - materials science , adhesion , surface energy , surface roughness , microelectromechanical systems , nano , surface (topology) , surface finish , component (thermodynamics) , composite material , silicon , energy (signal processing) , specific surface energy , nanotechnology , optoelectronics , thermodynamics , physics , geometry , mathematics , quantum mechanics
This paper compares and discusses the surface energy and its related factors between different kinds of micro-component materials commonly used in MEMS, and analyzes the nano-adhesion behaviors of their surfaces. The results by the Owens method show that the surface energies of the silicon-based materials are between 60—75 mJ/m2 and the presence of surface roughness would result in higher nominal surface energy when the contact angle is less than 90°. In contrast, the nominal surface energy would go much lower when the surface is rough with the coverage of a SAM film. There is a certain dependence of nano-adhesion on surface energy, and the effect of surface roughness on nano-adhesion can be neglected in the present study.