Open AccessStudy on the thermal interface resistance of the helix slow-wave structure
Author(s) -
Yu Han,
Yanwen Liu,
Yaogen Ding,
Pu-Kun Liu
Publication year - 2009
Publication title -
wuli xuebao
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.199
H-Index - 47
ISSN - 1000-3290
DOI - 10.7498/aps.58.1806
Subject(s) - thermal resistance , thermal , interfacial thermal resistance , materials science , interface (matter) , helix (gastropod) , dissipation , thermal grease , thermal contact conductance , composite material , thermal conductivity , thermodynamics , physics , capillary number , capillary action , snail , ecology , biology
The thermal interface resistance of the helix slow-wave structure SWS has been studied theoretically and experimentally. The effect of the thermal resistance at two interfaces on heat dissipation capability of the SWS is analyzed. A novel method to calculate the thermal interface resistance has been developed, and its accuracy and feasibility were validated by experiments. With this method, the thermal interface resistances at two interfaces can be calculated separately, considering the variation of the material performance with the temperature changes. This novel method is used to study the effect of the rod material and the assembling method on the thermal interface resistance.