Open AccessThe deformation mechanism of nanofilm with void under tensile loading: An atomistic simulation study
Author(s) -
Yang Zhang,
Jianhua Zhang,
Wen Yu-Hua,
Ziqi Zhu
Publication year - 2008
Publication title -
wuli xuebao
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.199
H-Index - 47
ISSN - 1000-3290
DOI - 10.7498/aps.57.7094
Subject(s) - materials science , void (composites) , microstructure , ultimate tensile strength , molecular dynamics , composite material , stacking , partial dislocations , modulus , deformation mechanism , deformation (meteorology) , condensed matter physics , dislocation , computational chemistry , physics , chemistry , nuclear magnetic resonance
In this paper, we employ molecular static approach with quantum corrected Sutten-Chen many-body potential to study the mechanical behavior of nickel nanofilm during uniaxial loading, and investigate its microstructure by common neighbor analysis methods. The simulated results show that the existence of void significantly weakens the Young’s modulus and yield stress of nanofilm; with the increased strain, the shape of void changes from circular into elliptical, and the void is eventually entirely closed. The plastic deformation of nanofilm is characterized by {111} glide associated with Shockley partial dislocations, resulting in the formation of stacking faults.