Open AccessMulti-scale simulation of the dynamic behaviors of nano-void in shocked material
Author(s) -
Jun Chen,
Xu Yun,
Dongquan Chen,
Jinshan Sun
Publication year - 2008
Publication title -
wuli xuebao
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.199
H-Index - 47
ISSN - 1000-3290
DOI - 10.7498/aps.57.6437
Subject(s) - void (composites) , materials science , adiabatic shear band , mechanics , finite element method , adiabatic process , molecular dynamics , structural engineering , strain rate , composite material , physics , thermodynamics , quantum mechanics , engineering
In this paper, the multi-scale numerical simulation method was used to simulate the dynamic behaviors of nano-void in metal Al under shock loading. This method couples the molecular dynamics method used in local defect domain and the finite element method used globally by using a bridge-scale function. Based on the calculated strain field and temperature field and atom positions, we reveal that the collapse of nano-void depends on the yield strength of materials and shock loading strength. And compression process of void is the main reason of formation of local hot spot. Meanwhile, the dislocation and hot spot induced by void collapse lead to the easy formation of the local adiabatic shear band.