Multi-scale simulation of the dynamic behaviors of nano-void in shocked material

In this paper, the multi-scale numerical simulation method was used to simulate the dynamic behaviors of nano-void in metal Al under shock loading. This method couples the molecular dynamics method used in local defect domain and the finite element method used globally by using a bridge-scale function. Based on the calculated strain field and temperature field and atom positions, we reveal that the collapse of nano-void depends on the yield strength of materials and shock loading strength. And compression process of void is the main reason of formation of local hot spot. Meanwhile, the dislocation and hot spot induced by void collapse lead to the easy formation of the local adiabatic shear band.